PRODUCT - PRODUCT
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Portable Audio Systems ※ Mobile Phones and PDAs ※ Operation of Various Digital Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Packaged in 12mm Wide Taping
Applications ※ Portable Audio Systems ※ Mobile Phones and PDAs ※ Operation of Various Digital Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Car Audio, Car Navigation Systems, Keyless Entry Systems ※ Used for Operating Various Electronic Devices such as Audio Equipment, Automotive Units, Communication Devices, Measurement Instruments, etc.
Features ※ Compact Size Helps Make Application Units Smaller and Lighter ※ Larger Button Surface Offers Better Operability and Installability ※ Packaged in 12mm Wide Taping