PRODUCT

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PRODUCT - PRODUCT

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THAM41
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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THAM41-E
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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TVAF44
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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TVAF44-E
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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THAM45
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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THAF46
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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THAF46-E
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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TVAF47
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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TVAF47-E
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

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TVEJ16-B
E Serie/6.2*6.2

Applications ※ Home Appliances ※ Car Navigation Systems, Car Audio Systems ※ Various Electronic Devices such as Audio Equipment, Office Equipment, Communication Devices, Test Instruments, Televisions, VCRs, Automobiles, etc.

Features ※ Rubber Buttons Provide Excellent Operability ※ Reflow Solderable ※ Packaged in 16mm Wide Printed Taping

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TVEM17-A
E Serie/6.2*6.2

Applications ※ Home Appliances ※ Car Navigation Systems, Car Audio Systems ※ Various Electronic Devices such as Audio Equipment, Office Equipment, Communication Devices, Test Instruments, Televisions, VCRs, Automobiles, etc.

Features ※ Rubber Buttons Provide Excellent Operability ※ Reflow Solderable ※ Packaged in 16mm Wide Printed Taping

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TVEJ16-026
E Serie/6.2*6.2

Applications ※ Home Appliances ※ Car Navigation Systems, Car Audio Systems ※ Various Electronic Devices such as Audio Equipment, Office Equipment, Communication Devices, Test Instruments, Televisions, VCRs, Automobiles, etc.

Features ※ Rubber Buttons Provide Excellent Operability ※ Reflow Solderable ※ Packaged in 16mm Wide Printed Taping