PRODUCT

产品系列

Tact switch - A Serie/Mini Type

model-image
THAU13
A Serie/Mini Type

Applications ※ Portable Devices ※ Mobile Phones and PDAs ※ Operation of Various Digital Devices

Features ※ Increase the Mounting Density of PCB Components ※ Side-type can be pressed on the side of the PCB ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Packaged in 12mm Wide Taping

model-image
THAF14
A Serie/Mini Type

Applications ※ Portable Devices ※ Mobile Phones and PDAs ※ Operation of Various Digital Devices

Features ※ Suitable for High-Density Installation ※ Side-type can be pressed on the side of the PCB ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Packaged in 12mm Wide Taping

model-image
TVAU15
A Serie/Mini Type

Applications ※ Used for Operating Various Electronic Devices ※ Audio Equipment, Office Equipment, Communication Devices ※ Measuring Instruments, Televisions, VCRs, etc.

Features ※ Compact, Low-profile SMT Keyboard Switch Design for High-Density Installation ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Reflow Solderable ※ 可以带接地用于静电释放

model-image
THAM16
A Serie/Mini Type

Applications ※ Used for Operating Various Electronic Devices ※ Audio Equipment, Office Equipment, Communication Devices ※ Measuring Instruments, Televisions, VCRs, etc.

Features ※ Compact, Low-profile SMT Keyboard Switch Design for High-Density Installation ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Reflow Solderable ※ Excellent Tactile Feedback lt;/p>

model-image
TVAF17
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

model-image
TVAF18
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability

model-image
THAM20
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

model-image
THAM21
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

model-image
TVAU22
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability

model-image
TVAU23
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

model-image
TVAF24
A Serie/Mini Type

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

model-image
TVAF28
A Serie/Mini Type

Applications ※ Smartphones, Tablets ※ Headphones, Wearable Devices ※ Laptops, Peripheral Devices

Features ※ Mini Size 2.5x3.5mm ※ Straight Press and Side Press Types ※ Long Lifespan