Tact switch - A Serie/Mini Type
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices
Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping
