PRODUCT

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

Applications ※ Used for Operating Various Mobile Devices ※ Used for Operating Various Devices Requiring High-Density Installation ※ Such as Mobile Phones, Communication Devices, Compact Electronic Devices ※ Electronic Devices

Features ※ Increase the Mounting Density of PCB Components ※ Reflow Solderable ※ Fully Encapsulated Contacts, Enhancing Reliability ※ Can be Grounded for Electrostatic Discharge (ESD) Protection ※ Packaged in 12mm Wide Taping

Applications ※ Smartphones, Tablets ※ Headphones, Wearable Devices ※ Laptops, Peripheral Devices

Features ※ Mini Size 2.5x3.5mm ※ Straight Press and Side Press Types ※ Long Lifespan

Applications ※ Smartphones, Tablets ※ Headphones, Wearable Devices ※ Laptops, Peripheral Devices

Features ※ Mini Size 2.5x3.5mm ※ Straight Press and Side Press Types ※ Long Lifespan

Applications ※ Smartphones, Tablets ※ Headphones, Wearable Devices ※ Laptops, Peripheral Devices

Features ※ Mini Size 4.5x2.2mm ※ Side Press, Central Mounting Type ※ 600,000 Cycle Long Lifespan lt;/p>

Applications ※ Mobile, Energy/Industrial, Gaming, Automotive

Features ※ Heavy-duty Operation Type with 1.4mm High Button and Grounding to Meet Automotive Requirements ※ With 1.4mm High Button and Grounding ※ Meets Automotive Requirements lt;/p>

Applications ※ Mobile, Energy/Industrial, Gaming, Automotive

Features ※ Heavy-duty Operation Type with 1.4mm High Button and Grounding to Meet Automotive Requirements ※ With 1.4mm High Button and Grounding ※ Meets Automotive Requirements lt;/p>

Applications ※ Smartphones, Tablets ※ Headphones, Wearable Devices ※ Laptops, Peripheral Devices

Features ※ Compact 3x2mm ※ 0.6mm High Slim Type ※ Long Lifespan